Bond line thickness control for die attachment

A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereaf...

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Bibliographische Detailangaben
Hauptverfasser: CHEUNG KWOK YUEN, LAM SHIU KEI, CHAN MAN WAI, YAU WAN YIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.