Electrostatic chucks, substrate treating apparatuses including the same, and substrate treating methods

Provided is an electrostatic chuck for fixing a substrate by using an electrostatic force, which include a dielectric plate on which the substrate is placed, a first electrode disposed in an inner center region of the dielectric plate, and charged negatively or positively, and a second electrode dis...

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Bibliographische Detailangaben
1. Verfasser: LEE WONHAENG
Format: Patent
Sprache:chi ; eng
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