Electrostatic chucks, substrate treating apparatuses including the same, and substrate treating methods
Provided is an electrostatic chuck for fixing a substrate by using an electrostatic force, which include a dielectric plate on which the substrate is placed, a first electrode disposed in an inner center region of the dielectric plate, and charged negatively or positively, and a second electrode dis...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is an electrostatic chuck for fixing a substrate by using an electrostatic force, which include a dielectric plate on which the substrate is placed, a first electrode disposed in an inner center region of the dielectric plate, and charged negatively or positively, and a second electrode disposed in an inner edge region of the dielectric plate to surround the first electrode, and charged with polarity opposite to that of the first electrode. The second electrode has an area different from that of the first electrode. |
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