Photosensitive composition and application thereof

A photosensitive composition, based on net weight of a composition without a solvent, contains 0.01 wt%-20wt% of hexaarylbiimidazole composition represented by formula I. The inventive photosensitive composition is taken as photoresist and is used for manufacturing printed circuit boards and flat pr...

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Bibliographische Detailangaben
Hauptverfasser:	WANG BAOHU, MENG CAIHONG, DI NINGYU, CAO WANRONG, GUO HAIMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	A photosensitive composition, based on net weight of a composition without a solvent, contains 0.01 wt%-20wt% of hexaarylbiimidazole composition represented by formula I. The inventive photosensitive composition is taken as photoresist and is used for manufacturing printed circuit boards and flat printing plates. Not only the application requirements of 365nm exposure devices and 405 nm exposure devices are met, but also the production efficiency of the printed circuit boards is effectively improved. The formula I is shown in the description.