One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board
The invention provides a one-step press forming process and a manufacturing method of a CPU (Central Processing Unit) back board. The one-step press forming process is a method which makes different thicknesses by a same material for one step, and comprises the following steps of: measuring the orig...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a one-step press forming process and a manufacturing method of a CPU (Central Processing Unit) back board. The one-step press forming process is a method which makes different thicknesses by a same material for one step, and comprises the following steps of: measuring the original thickness and area of a to-be-thinned part of the material so as to obtain the original volume of the to-be-thinned part of the material; calculating the thickness and area of the to-be-thinned part of the material after treatment so as to obtain the volume of the to-be-thinned part of the material after treatment; subtracting the volume of the to-be-thinned part of the material after treatment from the original volume of the to-be-thinned part of the material so as to obtain a to-be-removed volume; and removing the to-be-removed volume from the to-be-thinned part of the material; and pressing the to-be-thinned part of the material. The one-step press forming process provided by the invention has the advantage |
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