Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same

The invention provides etchants and methods of fabricating metal wirings and thin film transistor substrates using the same. The etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE SUCKJUN, YU INHO, PARK JI-YOUNG, KIM SANGGAB, CHOI SHIN IL, JIN YOUNGJUN, CHOUNG JONG-HYUN, SONG JEANHO, PARK YOUNGCHUL, KWON O. BYOUNG, LIM MINKI, KIM SEON-IL, JANG SANGHOON
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LEE SUCKJUN
YU INHO
PARK JI-YOUNG
KIM SANGGAB
CHOI SHIN IL
JIN YOUNGJUN
CHOUNG JONG-HYUN
SONG JEANHO
PARK YOUNGCHUL
KWON O. BYOUNG
LIM MINKI
KIM SEON-IL
JANG SANGHOON
description The invention provides etchants and methods of fabricating metal wirings and thin film transistor substrates using the same. The etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102827611A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102827611A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102827611A3</originalsourceid><addsrcrecordid>eNqNyk0KwjAQhuFuXIh6h_EAgqmg3UqpuHLlvkzSiQnkp2SmeH0NeABXH-_Hs270IMZhEgZME0QSlyeGbMGiLt6g-PSqNwZ4-1KjOnE-gfUhghRM7FlyAV40f1MIFq5QHAFjpG2zshiYdr_dNPvb8OzvB5rzSDyjoUQy9g91bLv2clbqevrHfABXVD4l</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same</title><source>esp@cenet</source><creator>LEE SUCKJUN ; YU INHO ; PARK JI-YOUNG ; KIM SANGGAB ; CHOI SHIN IL ; JIN YOUNGJUN ; CHOUNG JONG-HYUN ; SONG JEANHO ; PARK YOUNGCHUL ; KWON O. BYOUNG ; LIM MINKI ; KIM SEON-IL ; JANG SANGHOON</creator><creatorcontrib>LEE SUCKJUN ; YU INHO ; PARK JI-YOUNG ; KIM SANGGAB ; CHOI SHIN IL ; JIN YOUNGJUN ; CHOUNG JONG-HYUN ; SONG JEANHO ; PARK YOUNGCHUL ; KWON O. BYOUNG ; LIM MINKI ; KIM SEON-IL ; JANG SANGHOON</creatorcontrib><description>The invention provides etchants and methods of fabricating metal wirings and thin film transistor substrates using the same. The etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NATURAL RESINS ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121219&amp;DB=EPODOC&amp;CC=CN&amp;NR=102827611A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20121219&amp;DB=EPODOC&amp;CC=CN&amp;NR=102827611A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE SUCKJUN</creatorcontrib><creatorcontrib>YU INHO</creatorcontrib><creatorcontrib>PARK JI-YOUNG</creatorcontrib><creatorcontrib>KIM SANGGAB</creatorcontrib><creatorcontrib>CHOI SHIN IL</creatorcontrib><creatorcontrib>JIN YOUNGJUN</creatorcontrib><creatorcontrib>CHOUNG JONG-HYUN</creatorcontrib><creatorcontrib>SONG JEANHO</creatorcontrib><creatorcontrib>PARK YOUNGCHUL</creatorcontrib><creatorcontrib>KWON O. BYOUNG</creatorcontrib><creatorcontrib>LIM MINKI</creatorcontrib><creatorcontrib>KIM SEON-IL</creatorcontrib><creatorcontrib>JANG SANGHOON</creatorcontrib><title>Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same</title><description>The invention provides etchants and methods of fabricating metal wirings and thin film transistor substrates using the same. The etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyk0KwjAQhuFuXIh6h_EAgqmg3UqpuHLlvkzSiQnkp2SmeH0NeABXH-_Hs270IMZhEgZME0QSlyeGbMGiLt6g-PSqNwZ4-1KjOnE-gfUhghRM7FlyAV40f1MIFq5QHAFjpG2zshiYdr_dNPvb8OzvB5rzSDyjoUQy9g91bLv2clbqevrHfABXVD4l</recordid><startdate>20121219</startdate><enddate>20121219</enddate><creator>LEE SUCKJUN</creator><creator>YU INHO</creator><creator>PARK JI-YOUNG</creator><creator>KIM SANGGAB</creator><creator>CHOI SHIN IL</creator><creator>JIN YOUNGJUN</creator><creator>CHOUNG JONG-HYUN</creator><creator>SONG JEANHO</creator><creator>PARK YOUNGCHUL</creator><creator>KWON O. BYOUNG</creator><creator>LIM MINKI</creator><creator>KIM SEON-IL</creator><creator>JANG SANGHOON</creator><scope>EVB</scope></search><sort><creationdate>20121219</creationdate><title>Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same</title><author>LEE SUCKJUN ; YU INHO ; PARK JI-YOUNG ; KIM SANGGAB ; CHOI SHIN IL ; JIN YOUNGJUN ; CHOUNG JONG-HYUN ; SONG JEANHO ; PARK YOUNGCHUL ; KWON O. BYOUNG ; LIM MINKI ; KIM SEON-IL ; JANG SANGHOON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102827611A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2012</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE SUCKJUN</creatorcontrib><creatorcontrib>YU INHO</creatorcontrib><creatorcontrib>PARK JI-YOUNG</creatorcontrib><creatorcontrib>KIM SANGGAB</creatorcontrib><creatorcontrib>CHOI SHIN IL</creatorcontrib><creatorcontrib>JIN YOUNGJUN</creatorcontrib><creatorcontrib>CHOUNG JONG-HYUN</creatorcontrib><creatorcontrib>SONG JEANHO</creatorcontrib><creatorcontrib>PARK YOUNGCHUL</creatorcontrib><creatorcontrib>KWON O. BYOUNG</creatorcontrib><creatorcontrib>LIM MINKI</creatorcontrib><creatorcontrib>KIM SEON-IL</creatorcontrib><creatorcontrib>JANG SANGHOON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE SUCKJUN</au><au>YU INHO</au><au>PARK JI-YOUNG</au><au>KIM SANGGAB</au><au>CHOI SHIN IL</au><au>JIN YOUNGJUN</au><au>CHOUNG JONG-HYUN</au><au>SONG JEANHO</au><au>PARK YOUNGCHUL</au><au>KWON O. BYOUNG</au><au>LIM MINKI</au><au>KIM SEON-IL</au><au>JANG SANGHOON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same</title><date>2012-12-19</date><risdate>2012</risdate><abstract>The invention provides etchants and methods of fabricating metal wirings and thin film transistor substrates using the same. The etchant includes: a persulfate; a fluoride; an inorganic acid; a cyclic amine; a sulfonic acid; and one of an organic acid and a salt thereof.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN102827611A
source esp@cenet
subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NATURAL RESINS
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
title Etchants and methods of fabricating metal wiring and thin film transistor substrate using the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T08%3A42%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE%20SUCKJUN&rft.date=2012-12-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN102827611A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true