Structure and layout method of circuit module via chain

A structure and a layout method of a circuit module via chain can be applied to an advanced integrated circuit manufacture procedure and an integrated circuit test, an compared with existing via chain structures, the circuit module via chain structure in the invention comprises a plurality of metal...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN GUANYU, LI XINHONG, FANG BOXIANG, CAI MINGFAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A structure and a layout method of a circuit module via chain can be applied to an advanced integrated circuit manufacture procedure and an integrated circuit test, an compared with existing via chain structures, the circuit module via chain structure in the invention comprises a plurality of metal sheets which are annularly arranged, can significantly improve RF coupling and reduce crosstalk effects, in terms of the circumstance of feeding in AC signals or RF signals for testing, can prevent existing of fringing parasitic capacitance Cp of a certain degree, prevent an error in estimating a resistance value of a via, and further improve the overall integrated circuit manufacture procedure and the testing reliability.