Preparation method for porous copper-based shape memory alloy-based damping composite material

The invention discloses a preparation method for a porous copper-based shape memory alloy-based damping composite material and relates to preparation of damping materials. The method comprises the following steps of: performing thermal circulation and ultrasonic cleaning on a quenching-state porous...

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Hauptverfasser: CUI CHUNXIANG, LU DONGMEI, LI NUO, YAN NAJUN, WANG QINGZHOU, WANG QIAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a preparation method for a porous copper-based shape memory alloy-based damping composite material and relates to preparation of damping materials. The method comprises the following steps of: performing thermal circulation and ultrasonic cleaning on a quenching-state porous CuAlMn shape memory alloy sample to remove stains adhered to the outer surface of the sample and the inner surfaces of pores; immersing the sample in a polystyrene-2-methyltetrahydrofuran solution, and performing ultrasonic oscillation until the polystyrene-2-methyltetrahydrofuran solution is fully permeated into the pores of the porous CuAlMn shape memory alloy sample, which are communicated in a three-dimensional way; and finally drying until the 2-methyltetrahydrofuran solvent is volatilized completely to prepare a porous copper-based shape memory alloy-based damping composite material finished product, wherein polystyrene layers are deposited in the pores of the porous CuAlMn shape memory alloy. The finished pr