Surface metallization layer of high-purity alumina ceramics and compounding technology thereof

The invention discloses a surface metallization layer of high-purity alumina ceramics and a compounding technology thereof. The surface metallization layer of high-purity alumina ceramics comprises the following ingredients: 45-65wt% of Mo powder, 11-18wt% of Mn powder, 7-15wt% of SiO2 powder, 0.2-2...

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Hauptverfasser: GUO KUANHONG, TAO YINGQI, LU LINGJIE
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a surface metallization layer of high-purity alumina ceramics and a compounding technology thereof. The surface metallization layer of high-purity alumina ceramics comprises the following ingredients: 45-65wt% of Mo powder, 11-18wt% of Mn powder, 7-15wt% of SiO2 powder, 0.2-2.5wt% of CaO, 5-15wt% of 75% alumina porcelain powder, 0-5wt% of TiO2, and 10-17wt% of Al2O3. The compounding technology comprises the following steps: weighing the above ingredients of the metalization layer in proportion and mixing, putting the mixture in a high-energy bowl mill, conducting high-energy ball milling for more than 96 h with an organic medium, then drying, sieving to prepare metallization powder for subsequent use; adding a proper amount of organic binder in the prepared metallization powder, fully stirring, and covering the clean surface of high-purity alumina ceramics by screen-printing process; sintering the high-purity alumina ceramics covered with the metallization powder under the protection o