Machine for manufacturing electrode tape

A machine for manufacturing an electrode tape includes a means for adhering an adhesive material to a sidewall of a conductive structure but not covering a first contact point and a second contact point of the conductive structure, and a means for curing the adhesive material into a film including a...

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Bibliographische Detailangaben
Hauptverfasser:	LIN CHING-HUANG, LIANG RONGANG, TSAI PEIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A machine for manufacturing an electrode tape includes a means for adhering an adhesive material to a sidewall of a conductive structure but not covering a first contact point and a second contact point of the conductive structure, and a means for curing the adhesive material into a film including a first adhesive surface on which the first contact point is exposed and a second adhesive surface on which the second contact point is exposed, wherein the first adhesive surface and the second adhesive surface face outwardly to each other.