Method for producing wafer level package and corresponding semiconductor package

The invention relates to a method for producing a wafer level package and a corresponding semiconductor package. More specifically, the invention relates to a semiconductor packaging process including drilling apertures in a reconstituted wafer and then filling the apertures with conductive paste by wiping a quantity of the paste across a back surface of the wafer so that paste is forced into the apertures. The paste is cured to form conductive posts. The wafer is thinned, and redistribution layers are formed on front and back surfaces of the wafer, with the conductive posts acting as interconnections between the redistribution layers. In an alternative process, blind apertures are drilled. A dry film resist is applied to the front surface of the wafer, and patterned to expose the apertures. Conductive paste is applied from the front. To prevent paste from trapping air pockets in the apertures, the wiping process is performed under vacuum. After the paste is cured, the wafer is thinned to expose the cured pas