Sensor module and production method of a sensor module

The invention relates to a sensor module comprising a chip carrier and a sensor chip disposed thereon. The sensor module comprises at least one partial cover having a recess on a second face of the chip carrier, such that heat from the chip carrier and/or the sensor chip can be dissipated to the rec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	REITMEIER WILLIBALD, HAUSCHEL JAN-ERIK, KNITTEL THORSTEN, PESAHL STEFAN, WILDGEN ANDREAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS SEMICONDUCTOR DEVICES TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	The invention relates to a sensor module comprising a chip carrier and a sensor chip disposed thereon. The sensor module comprises at least one partial cover having a recess on a second face of the chip carrier, such that heat from the chip carrier and/or the sensor chip can be dissipated to the recess. The invention further relates to a method for producing a covered sensor module, wherein the cover comprises a recess.