Cover opening method of rigid and flexible plate

Cover opening method of rigid and flexible plate

The invention discloses a cover opening method of a rigid and flexible plate. The cover opening method of the rigid and flexible plate includes the following steps of chemical pretreatment-filming-exposure-development-etching-stripping-copper deposition + flash plating. The chemical cover opening me...

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Hauptverfasser: ZHANG RONGCHEN, ZHAO YUMEI, ZHOU YONG, WU SHAOHUI
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ZHANG RONGCHEN
ZHAO YUMEI
ZHOU YONG
WU SHAOHUI
description The invention discloses a cover opening method of a rigid and flexible plate. The cover opening method of the rigid and flexible plate includes the following steps of chemical pretreatment-filming-exposure-development-etching-stripping-copper deposition + flash plating. The chemical cover opening method is different from an existing laser cover opening method, can prevent a covering film and a flexible plate at a joint area of the flexible plate and a rigid plate from being cut, and improves product quality. Furthermore, the chemical cover opening method does not need to adopt a laser cutting machine so as to save machine cost greatly, and simultaneously replaces existing polyimide (PI) with copper foil so as to reduce plate thickness and greatly save material cost.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Cover opening method of rigid and flexible plate
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