Cover opening method of rigid and flexible plate
The invention discloses a cover opening method of a rigid and flexible plate. The cover opening method of the rigid and flexible plate includes the following steps of chemical pretreatment-filming-exposure-development-etching-stripping-copper deposition + flash plating. The chemical cover opening me...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a cover opening method of a rigid and flexible plate. The cover opening method of the rigid and flexible plate includes the following steps of chemical pretreatment-filming-exposure-development-etching-stripping-copper deposition + flash plating. The chemical cover opening method is different from an existing laser cover opening method, can prevent a covering film and a flexible plate at a joint area of the flexible plate and a rigid plate from being cut, and improves product quality. Furthermore, the chemical cover opening method does not need to adopt a laser cutting machine so as to save machine cost greatly, and simultaneously replaces existing polyimide (PI) with copper foil so as to reduce plate thickness and greatly save material cost. |
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