Method for manufacturing high-frequency metal-base circuit base board

The invention discloses a method for manufacturing a high-frequency metal-base circuit base board. The method comprises the following steps: mixing polytetrafluoroethylene powder with polyphenyl ether powder; carrying out ball grinding through a ball grinding mill; placing a base board dielectric material in a die to form a base board dielectric material layer by high-temperature press fit; selecting glass fiber fabric, placing the glass fiber fabric in PTEE (polytetrafluoroethylene) resin and carrying out pre-impregnation through an impregnator; manufacturing glass fiber impregnated bonding sheets after carrying out high-temperature sintering; then, selecting a copper foil layer, an insulating dielectric material layer, the glass fiber impregnated bonding sheets and a metal base material, wherein the insulating dielectric material layer is arranged above copper foil; one glass fiber impregnated bonding sheet is used to isolate and bond the insulating dielectric material layer and the copper foil, a metal bas