Array substrate and manufacturing method thereof
A method for manufacturing an array substrate comprises the following steps, successively forming a first conductive layer, a grid electrode dielectric layer, a semiconductor layer, an etching barrier layer and first patterning photoresist on the substrate; carrying out a first etching process, and...
Gespeichert in:
Hauptverfasser: | , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method for manufacturing an array substrate comprises the following steps, successively forming a first conductive layer, a grid electrode dielectric layer, a semiconductor layer, an etching barrier layer and first patterning photoresist on the substrate; carrying out a first etching process, and removing the etching barrier layer and the semiconductor layer uncovered by the first patterning photoresist; carrying out a second etching technology to form a patterning grid electrode dielectric layer and a patterning etching barrier layer; removing the first conductive layer uncovered by the patterning grid electrode dielectric layer to form a grid electrode; and removing the semiconductor layer uncovered by the patterning etching barrier layer to form a patterning semiconductor layer, and partially exposing the patterning grid electrode dielectric layer. |
---|