Array substrate and manufacturing method thereof

A method for manufacturing an array substrate comprises the following steps, successively forming a first conductive layer, a grid electrode dielectric layer, a semiconductor layer, an etching barrier layer and first patterning photoresist on the substrate; carrying out a first etching process, and...

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Bibliographische Detailangaben
Hauptverfasser: ZHOU QIWEI, CHEN YUHONG, CHEN JIAYU, ZHANG FANWEI, DING HONGZHE, ZHONG YIZHEN, GUI HUILING, LV XUEXING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A method for manufacturing an array substrate comprises the following steps, successively forming a first conductive layer, a grid electrode dielectric layer, a semiconductor layer, an etching barrier layer and first patterning photoresist on the substrate; carrying out a first etching process, and removing the etching barrier layer and the semiconductor layer uncovered by the first patterning photoresist; carrying out a second etching technology to form a patterning grid electrode dielectric layer and a patterning etching barrier layer; removing the first conductive layer uncovered by the patterning grid electrode dielectric layer to form a grid electrode; and removing the semiconductor layer uncovered by the patterning etching barrier layer to form a patterning semiconductor layer, and partially exposing the patterning grid electrode dielectric layer.