Epoxy waterproof system
The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. The epoxy waterproof system...
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| creator | SUN LEI FENG PEIQUAN YU JIGUANG JIANG SHUANGHE HUANG CHEN SUN QIAN |
| description | The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. The epoxy waterproof system provided by the invention has the advantage that types and contents of components of the epoxy waterproof system are screened, thus the bond strength is greatly improved. |
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The epoxy waterproof system provided by the invention has the advantage that types and contents of components of the epoxy waterproof system are screened, thus the bond strength is greatly improved.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120926&DB=EPODOC&CC=CN&NR=102690623A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120926&DB=EPODOC&CC=CN&NR=102690623A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN LEI</creatorcontrib><creatorcontrib>FENG PEIQUAN</creatorcontrib><creatorcontrib>YU JIGUANG</creatorcontrib><creatorcontrib>JIANG SHUANGHE</creatorcontrib><creatorcontrib>HUANG CHEN</creatorcontrib><creatorcontrib>SUN QIAN</creatorcontrib><title>Epoxy waterproof system</title><description>The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. 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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | Epoxy waterproof system |
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