Epoxy waterproof system

The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. The epoxy waterproof system...

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Bibliographische Detailangaben
Hauptverfasser:	SUN LEI, FENG PEIQUAN, YU JIGUANG, JIANG SHUANGHE, HUANG CHEN, SUN QIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides an epoxy waterproof system which comprises bisphenol A epoxy resin and bisphenol F epoxy resin, wherein based on the weight, the content of the bisphenol A epoxy resin is 20-30 percent, and the content of the bisphenol F epoxy resin is 5-10 percent. The epoxy waterproof system provided by the invention has the advantage that types and contents of components of the epoxy waterproof system are screened, thus the bond strength is greatly improved.