Chuck structure and device for processing semiconductor substrate using the same

PURPOSE: A chuck structure and a semiconductor substrate processing apparatus using the same are provided to prevent the generation of uneven temperature gradient at chuck by omitting a lift pin for loading and unloading a substrate. CONSTITUTION: A main body(12) supports a chuck(14). A heating elem...

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Bibliographische Detailangaben
Hauptverfasser:	LEE SEONG JAE, HAN KYO SHIK, CHOI IN GYU, PARK DONG JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A chuck structure and a semiconductor substrate processing apparatus using the same are provided to prevent the generation of uneven temperature gradient at chuck by omitting a lift pin for loading and unloading a substrate. CONSTITUTION: A main body(12) supports a chuck(14). A heating element is placed inside the chuck. A fixing guide ring(20) is mounted on the outer circumference of the chuck. Moving guide rings(32a,32b) are driven upwards and downwards in the moving guide ring mounting units(22a,22b) formed on the fixing guide ring. The moving guide rings are connected to a moving guide ring connection unit. A drive pin(16a) moves the moving guide rings upwards and downwards. An arrangement groove is formed on the moving guide rings for settling a substrate.