Substrate for electronic circuits
The invention relates to carrier materials for printing electrically conductive structures by means of inkjet printing using inks comprising conductive particles, leading to low resistances of the printed structures without thermal post-treatment, if said materials comprise a microporous layer as th...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to carrier materials for printing electrically conductive structures by means of inkjet printing using inks comprising conductive particles, leading to low resistances of the printed structures without thermal post-treatment, if said materials comprise a microporous layer as the outer layer, having an average pore size of less than 100 nm. |
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