Polymer thick film silver electrode composition for use as a plating link
The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. Th...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions. |
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