Method for processing rubber surface and sealing member

Provided is a method for processing a rubber surface which comprises one of the first mode in which a large number of small holes (11...) are formed in a regular dotted pattern on a surface (1a) of a rubber base member (1) by laser irradiation from a laser irradiation device (2), the second mode in...

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Bibliographische Detailangaben
Hauptverfasser:	HINO MAKOTO, YAMAMOTO TOMOHISA, ASANUMA CHIHIRO, MITOOKA YUTAKA, YOKOTA RITSUKO, KATAYAMA TATSUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BLASTING CHEMISTRY COMPOSITIONS BASED THEREON CYLINDERS ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GENERAL PROCESSES OF COMPOUNDING HEATING LIGHTING MECHANICAL ENGINEERING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PISTONS SEALINGS THEIR PREPARATION OR CHEMICAL WORKING-UP THERMAL INSULATION IN GENERAL WEAPONS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a method for processing a rubber surface which comprises one of the first mode in which a large number of small holes (11...) are formed in a regular dotted pattern on a surface (1a) of a rubber base member (1) by laser irradiation from a laser irradiation device (2), the second mode in which the superficial part of the rubber base member (1) is peeled and removed by the laser irradiation from the laser irradiation device (2), and the third mode which consists of the first mode and the second mode. Also, provided is a sealing member (6) including a seal lip part which has been processed by one of these processing methods.