Multilayer ceramic capacitor grinding process and application of multilayer ceramic capacitor grinding process

The invention discloses a multilayer ceramic capacitor grinding process and an application of the multilayer ceramic capacitor grinding process. A ground chip is a sintered ceramic front chip, the volume ratio of the chip to water to surfactants is (200-650): (500-800): (5-20), and the operation curve is characterized in that the operation lasts 15 to 25 minutes at the rotation speed being 35 to 65 revolutions per minute (RPM), the operation lasts 15 to 25 RPM at the rotation speed being 55 to 85 RPM, and the operation lasts 110 to 150 minutes at the rotation speed being 110 to 150 RPM. The multilayer ceramic capacitor grinding process is applied to the preparation of multilayer ceramic capacitors, the traditional concept of grinding products after sintering is changed, the products are ground in advance after being cut, and the grinding is more easily than the grinding after the products are sintered into ceramics, so the grinding time is greatly shortened, and the production processing cost is saved; and me