Method for the removal of deposition, method for the protection of an optical element, device manufacturing method, and lithographic apparatus

Method for the removal of deposition, method for the protection of an optical element, device manufacturing method, and lithographic apparatus

The invention provides a method for the removal of deposition, a method for the protection of an optical element, a device manufacturing method, and a lithographic apparatus. A method for the removal of a deposition on an optical element of an apparatus including the optical element includes providi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VAN HERPEN MAARTEN MARINUS JOH, BANINE VADIM Y, KLUNDER DERK JAN W, MOORS JOHANNES HUBERTUS J, SPEE CAROLUS IDA M A, ZALM PETER CORNELIS
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:The invention provides a method for the removal of deposition, a method for the protection of an optical element, a device manufacturing method, and a lithographic apparatus. A method for the removal of a deposition on an optical element of an apparatus including the optical element includes providing an H 2 containing gas in at least part of the apparatus includes producing hydrogen radicals from H 2 from the H 2 containing gas; and bringing the optical element with deposition into contact with at least part of the hydrogen radicals and removing at least part of the deposition. Further, a method for the protection of an optical element of an apparatus including the optical element includes providing a cap layer to the optical element by a deposition process; and during or after use of the apparatus, removing at least part of the cap layer from the optical element in a removal process as described above. The methods can be applied in a lithographic apparatus.