Method for realizing copper-copper bonding through current sintering technology and device thereof

The invention discloses a method for performing copper-copper bonding in an electronic device through a current sintering technology and a device for accomplishing the current sintering method, and belongs to the field of novel sintering technology in power electronic packaging. The method is accomplished through a heating stage and a pressure power-on testing machine, wherein the pressure power-on testing machine can adjust the pressure, the current and the power-on time in a test, and applies pressure and conduction current to a bonding device through a pressure-bearing conducting die. The pressure-bearing conducting die consists of an upper loading plate and a lower tray. A preheated bonding copper device, on which nano-silver paste is coated, is laid on the lower tray, and when the upper loading plate exerts pressure, current is conducted, so that the sintering of the nano-silver paste is realized. The method has the advantages of being high in efficiency, low in cost, convenient in operation and high in