Heat dissipating module

A heat dissipating module is adapted for dissipating thermal energy from an electronic element mounted on a circuit board, and includes a heat sink, a heat conductive board including a plurality of tube portions that extend through the circuit board, a heat conductive tube that interconnects the heat sink and the circuit board, and a plurality of fixing elements. Each fixing elements includes a first end part be secured to the heat conductive board, a second end part exposed from an end opening of a respective tube portion, and a pair of interference parts that extend resiliently, respectively and outwardly through lateral openings of the respective the tube portion for abutting against the circuit board. The heat dissipating module further includes a resilient unit disposed between and connected resiliently to the circuit board and the heat conductive board.