Device for surface roughening copper plate, and surface roughened copper plate

PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion as a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (a 3 and another 3 in the representative figure) as a similar pole for therebetween to be opposed to each other in an electroplating solution for plating copper (a 2 therein), and then to be arranged a copper plate (a 4 therein) at therebetween. And then at first there becomes to be performed an anodic treatment for generating a fine particle of copper on both surfaces of the copper plate (4), by performing an electrolytic process with the copper plate (4) as a positive electrode therefor and the electrodes (3) and the other (3) as negative electrodes therefor. And then thereafter there becomes to be performed a cathodi