High temperature resistant acrylic acid ester adhesive

The invention relates to a high temperature resistant acrylic acid ester adhesive and belongs to the technical field of dual-component acrylic acid ester adhesive. After a present fast-curing acrylic acid ester structured adhesive is baked at 180 DEG C, its glue-line structure is destroyed and can not satisfy structural bonding requirements. The invention mainly solves the problem of the present fast-curing acrylic acid ester structured adhesive. The high temperature resistant acrylic acid ester adhesive is mainly characterized by comprising two components, namely a main agent and a curing agent. The main agent contains the following components of: by weight, 25-80 parts of an acrylate monomer containing at least one vinyl, 0-25 parts of methacrylic acid, 0-25 parts of an elastomer, 0.1-5 parts of a stabilizing agent, 0.5-8 parts of an initiator, and 0-50 parts of an inorganic filling material. The curing agent contains the following components of: by weight, 25-80 parts of an acrylate monomer containing at l