Lead-free soldering paste and preparation method thereof

The invention discloses lead-free soldering paste, which comprises 20 to 50 percent by weight of abietic resin, 10 to 20 percent by weight of hydroxycarboxylic acid active agent, 2 to 10 percent by weight of bromocarbazole active reinforcer, 2 to 5 percent by weight of fatty amine curing agent, 2 to...

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Bibliographische Detailangaben
Hauptverfasser:	SU MINGBIN, DENG YONG, YAN HEGANG, SU CHUANGANG, SU CHUANMENG, HE FANLI, SU YANXUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses lead-free soldering paste, which comprises 20 to 50 percent by weight of abietic resin, 10 to 20 percent by weight of hydroxycarboxylic acid active agent, 2 to 10 percent by weight of bromocarbazole active reinforcer, 2 to 5 percent by weight of fatty amine curing agent, 2 to 10 percent by weight of thixotropic agent and 20 to 50 percent by weight of solvent. In the soldering paste, hydroxycarboxylic acid active agent is matched with bromocarbazole active reinforcer to greatly reinforce the solder paste activity, and in addition, the fatty amine curing agent is used for effectively improving the solder paste collapse resistance. The soldering paste is suitable for manufacturing lead-free soldering flux into lead-free solder paste; and the lead-free solder paste is strong in activity and collapse resistance, good in wettability, high in surface insulation resistance and long in guarantee period; and is suitable for welding chips with superfine gaps, simple in manufacturing method and ea