Carrier for glass substrates

A carrier (31) for a thin glass sheet (7) is disclosed. The carrier includes an elastomer (9) which has first (15) and second (17) opposed surfaces and a support (11) bonded to the first surface (15) of the elastomer (9). During use, the thin glass sheet (7) directly contacts and is releasably bonde...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WAKU-NSIMBA JEAN, WONDRACZEK KATRIN, CARRE ALAIN R, FRANCOIS ERIC J
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR BASIC ELECTRIC ELEMENTS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING HANDLING THIN OR FILAMENTARY MATERIAL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	A carrier (31) for a thin glass sheet (7) is disclosed. The carrier includes an elastomer (9) which has first (15) and second (17) opposed surfaces and a support (11) bonded to the first surface (15) of the elastomer (9). During use, the thin glass sheet (7) directly contacts and is releasably bonded to the elastomer's second surface (17). In order to provide a strong, yet releasable bond to the thin glass sheet (7), the elastomer's second surface (17) has a Shore A hardness in the range of 10-90 and a roughness less than or equal to 185 nanometers. In this way, the carrier/glass sheet assembly (13) is able to withstand the conditions encountered during manufacture of electronic components on the exposed surface (23) of the thin glass sheet (7).