Surface modified heat conduction particles, preparation method, and application thereof
The present invention relates to a surface modification method for heat conduction particles, surface modified heat conduction particles prepared by the method, thermal interface materials by using the surface modified heat conduction particles, and a preparation method thereof. The surface modifica...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to a surface modification method for heat conduction particles, surface modified heat conduction particles prepared by the method, thermal interface materials by using the surface modified heat conduction particles, and a preparation method thereof. The surface modification method for the heat conduction particles comprises the following steps: providing a plurality of heat conduction particles; carrying out an electrochemical pretreatment step for the heat conduction particles to increase surface -OH groups of the heat conduction particles; mixing the electrochemical-pretreated heat conduction particles and a coupling agent so as to carry out a coupling reaction for the -OH groups on the surfaces of the heat conduction particles and the coupling agent to prepare a plurality of the surface modified heat conduction particles. With the present invention, the surface modification degree of the heat conduction particles can be increased; the prepared surface modified heat conduction |
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