Heat-removal LED (light-emitting diode) integrating SiC substrate and diamond film

The invention discloses a heat-removal LED (light-emitting diode) integrating a SiC substrate and a diamond film, and the LED comprises a PCB (printed circuit board) (7) and is characterized in that the heating surface of the PCB (7) is contacted with the bottom surface of a diamond substrate (6), the upper bottom surface of the diamond substrate (6) is connected with an active layer (2) by virtue of an inverted welding layer, and the active layer (2) grows on a SiC epitaxial substrate (1); and a P-type electrode (4) and an N-type electrode (8) which are used for controlling the current of the active layer (2) are arranged on the diamond substrate (6) and connected with the PCB (7) by virtue of corresponding electrode lines (5, 9), and the PCB (7) is controlled by a temperature sensor (10) so as to implement the current adjustment, thereby controlling the light-emitting amount of the active layer (2) so as to ensure that the active layer (2) operates within the optimum temperature range. By using the LED disc