Non-carrier semiconductor packaging part and manufacturing method thereof

The invention discloses a non-carrier semiconductor packaging part and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a plurality of grooves and corresponding metal blocks on a metal carrier plate in a semi-etching manner; filling first colloids into the grooves so that the first colloids are directly bonded with the metal blocks; forming a connecting pad on the metal blocks, wherein the connecting pad is electrically coupled with the metal blocks, and the connecting pad and the metal blocks form a T-shaped structure so as to enhance the bonding property between the metal blocks and the first colloids and avoid the delamination problem; and then performing die-bonding, wire-bonding, packaging and mold-pressing to finally obtain the non-carrier semiconductor packaging part. The manufacturing method has the beneficial effects that the previously semi-etched grooves are filled with the first colloids, so that the problem that the existing semi-etched copper plate