High-strength halogen-free epoxy molding compound, and preparation method thereof

The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening mat...

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Bibliographische Detailangaben

1. Verfasser:	CHEN HUOBAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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