High-strength halogen-free epoxy molding compound, and preparation method thereof
The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening mat...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening material, 100 to 250 parts of a filling material, 100 to 250 parts of a fire retardant and CTI modifier, and 10 to 50 parts of an auxiliary agent. The preparation method comprises steps that: the materials are well mixed, crushed, mixed, fused and mixed, cooled and crushed, and packaged. The preparation method of the modified epoxy resin comprises steps that: 100 parts of epoxy resin and 5 to 20 parts of liquid rubber are mixed for 4 to 6 hours under a temperature of 100 DEG C to 130 DEG C, the product is cooled, and the product is crushed to a size below 20 meshes. The invention is advantages in that: with the high-strength halogen-free epoxy molding compound prepared by the invention, the produced product has high m |
---|