High-strength halogen-free epoxy molding compound, and preparation method thereof

The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening mat...

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1. Verfasser: CHEN HUOBAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a high-strength halogen-free epoxy molding compound, and a preparation method thereof. The molding compound comprises raw materials of: 100 parts of modified epoxy resin, 0 to 100 parts of epoxy resin, 20 to 100 parts of a curing agent, 140 to 250 parts of a strengthening material, 100 to 250 parts of a filling material, 100 to 250 parts of a fire retardant and CTI modifier, and 10 to 50 parts of an auxiliary agent. The preparation method comprises steps that: the materials are well mixed, crushed, mixed, fused and mixed, cooled and crushed, and packaged. The preparation method of the modified epoxy resin comprises steps that: 100 parts of epoxy resin and 5 to 20 parts of liquid rubber are mixed for 4 to 6 hours under a temperature of 100 DEG C to 130 DEG C, the product is cooled, and the product is crushed to a size below 20 meshes. The invention is advantages in that: with the high-strength halogen-free epoxy molding compound prepared by the invention, the produced product has high m