Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure
The invention provides a method for preparing an ultraviolet sensor with a gallium oxide one-dimensional sub-micrometer structure. The method comprises the following six steps of: 1, placing a silicon carbide (SiC) substrate carrying metal gallium in a heating region of a tube-type furnace to heat;...
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creator | XIN XIANDONG HAO WEICHANG CHENG JINYANG WANG TIANMIN |
description | The invention provides a method for preparing an ultraviolet sensor with a gallium oxide one-dimensional sub-micrometer structure. The method comprises the following six steps of: 1, placing a silicon carbide (SiC) substrate carrying metal gallium in a heating region of a tube-type furnace to heat; 2, ventilating argon into the furnace before the temperature reaches 500 DEG C, continuously heating till the temperature is 900-1,000 DEG C, and preserving the heat for 1-3 hours; 3, cooling to a room temperature so as to obtain white floccus gallium oxide (Ga2O3) one-dimensional sub-micrometer structure; 4, picking out one or more prepared Ga2O3 one-dimensional sub-micrometer structures on the SiC substrate by using a semiconductor probe and placing on a sensor substrate; 5, fixing all the Ga2O3 one-dimensional sub-micrometer structures on the sensor substrate, and evaporating and plating aurum (Au) or argentum (Ag) to prepare an electrode by using a magnetron sputtering or thermal evaporation coating device; and |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN102222730A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN102222730A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN102222730A3</originalsourceid><addsrcrecordid>eNqNijEOwjAMALswIOAP5gGRCh2YUVXEAhN7FVK3tZTEkeMAz6cDD-CWG-7WlbuhzjzAyAJJMFmhOEHxKvZF7FEhY8xLfJPOMFnvqQTgDw0IHNEMFJZOHK2HXJ4mkBMOqCiQVYrTIritVqP1GXc_b6r9pXu0V4OJe8zJOoyofXs_1MeFU1Ofm3-eLzJZP5Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure</title><source>esp@cenet</source><creator>XIN XIANDONG ; HAO WEICHANG ; CHENG JINYANG ; WANG TIANMIN</creator><creatorcontrib>XIN XIANDONG ; HAO WEICHANG ; CHENG JINYANG ; WANG TIANMIN</creatorcontrib><description>The invention provides a method for preparing an ultraviolet sensor with a gallium oxide one-dimensional sub-micrometer structure. The method comprises the following six steps of: 1, placing a silicon carbide (SiC) substrate carrying metal gallium in a heating region of a tube-type furnace to heat; 2, ventilating argon into the furnace before the temperature reaches 500 DEG C, continuously heating till the temperature is 900-1,000 DEG C, and preserving the heat for 1-3 hours; 3, cooling to a room temperature so as to obtain white floccus gallium oxide (Ga2O3) one-dimensional sub-micrometer structure; 4, picking out one or more prepared Ga2O3 one-dimensional sub-micrometer structures on the SiC substrate by using a semiconductor probe and placing on a sensor substrate; 5, fixing all the Ga2O3 one-dimensional sub-micrometer structures on the sensor substrate, and evaporating and plating aurum (Au) or argentum (Ag) to prepare an electrode by using a magnetron sputtering or thermal evaporation coating device; and</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111019&DB=EPODOC&CC=CN&NR=102222730A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111019&DB=EPODOC&CC=CN&NR=102222730A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XIN XIANDONG</creatorcontrib><creatorcontrib>HAO WEICHANG</creatorcontrib><creatorcontrib>CHENG JINYANG</creatorcontrib><creatorcontrib>WANG TIANMIN</creatorcontrib><title>Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure</title><description>The invention provides a method for preparing an ultraviolet sensor with a gallium oxide one-dimensional sub-micrometer structure. The method comprises the following six steps of: 1, placing a silicon carbide (SiC) substrate carrying metal gallium in a heating region of a tube-type furnace to heat; 2, ventilating argon into the furnace before the temperature reaches 500 DEG C, continuously heating till the temperature is 900-1,000 DEG C, and preserving the heat for 1-3 hours; 3, cooling to a room temperature so as to obtain white floccus gallium oxide (Ga2O3) one-dimensional sub-micrometer structure; 4, picking out one or more prepared Ga2O3 one-dimensional sub-micrometer structures on the SiC substrate by using a semiconductor probe and placing on a sensor substrate; 5, fixing all the Ga2O3 one-dimensional sub-micrometer structures on the sensor substrate, and evaporating and plating aurum (Au) or argentum (Ag) to prepare an electrode by using a magnetron sputtering or thermal evaporation coating device; and</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEOwjAMALswIOAP5gGRCh2YUVXEAhN7FVK3tZTEkeMAz6cDD-CWG-7WlbuhzjzAyAJJMFmhOEHxKvZF7FEhY8xLfJPOMFnvqQTgDw0IHNEMFJZOHK2HXJ4mkBMOqCiQVYrTIritVqP1GXc_b6r9pXu0V4OJe8zJOoyofXs_1MeFU1Ofm3-eLzJZP5Y</recordid><startdate>20111019</startdate><enddate>20111019</enddate><creator>XIN XIANDONG</creator><creator>HAO WEICHANG</creator><creator>CHENG JINYANG</creator><creator>WANG TIANMIN</creator><scope>EVB</scope></search><sort><creationdate>20111019</creationdate><title>Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure</title><author>XIN XIANDONG ; HAO WEICHANG ; CHENG JINYANG ; WANG TIANMIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN102222730A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><toplevel>online_resources</toplevel><creatorcontrib>XIN XIANDONG</creatorcontrib><creatorcontrib>HAO WEICHANG</creatorcontrib><creatorcontrib>CHENG JINYANG</creatorcontrib><creatorcontrib>WANG TIANMIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XIN XIANDONG</au><au>HAO WEICHANG</au><au>CHENG JINYANG</au><au>WANG TIANMIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure</title><date>2011-10-19</date><risdate>2011</risdate><abstract>The invention provides a method for preparing an ultraviolet sensor with a gallium oxide one-dimensional sub-micrometer structure. The method comprises the following six steps of: 1, placing a silicon carbide (SiC) substrate carrying metal gallium in a heating region of a tube-type furnace to heat; 2, ventilating argon into the furnace before the temperature reaches 500 DEG C, continuously heating till the temperature is 900-1,000 DEG C, and preserving the heat for 1-3 hours; 3, cooling to a room temperature so as to obtain white floccus gallium oxide (Ga2O3) one-dimensional sub-micrometer structure; 4, picking out one or more prepared Ga2O3 one-dimensional sub-micrometer structures on the SiC substrate by using a semiconductor probe and placing on a sensor substrate; 5, fixing all the Ga2O3 one-dimensional sub-micrometer structures on the sensor substrate, and evaporating and plating aurum (Au) or argentum (Ag) to prepare an electrode by using a magnetron sputtering or thermal evaporation coating device; and</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
title | Method for preparing ultraviolet sensor with gallium oxide one-dimensional sub-micrometer structure |
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