Heat radiation support with integrated packaging
The invention provides a heat radiation support with integrated packaging. The radiation support comprises a metal substrate, wherein as least a first groove is arranged on the metal substrate, at least a second groove used for carried out bonding on an LED chip is arranged within the first groove,...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The invention provides a heat radiation support with integrated packaging. The radiation support comprises a metal substrate, wherein as least a first groove is arranged on the metal substrate, at least a second groove used for carried out bonding on an LED chip is arranged within the first groove, and an insulting layer is on the surface of the metal substrate. The radiation support provided in the invention has advantages of simple structure, low cost, and good heat radiating effect. Besides, shape-preserving gluing packaging is allowed during the packaging, so that the color of emitted light has good uniformity and purity of the color of the emitted light is ensured. |
|---|