Led array module and fabrication method thereof

The present invention relates to an LED array module and a fabrication method thereof which can freely configure a circuit in serial and parallel for a plurality of LEDs by forming radiation blocks into an upper conductive layer and a lower conductive layer and partitioning each layer into multiple slices, thereby managing various output requirements, in an LED module which has radiation blocks which function to radiate the high-temperature heat generated by the emission of the LEDs by attaching the LEDs to the radiation blocks without using a printed circuit board (PCB). The present invention comprises: a first step (S100) of laminating and fixing an upper conductive layer (100) and a lower conductive layer (200) by an insulation bonding layer (300); a second step (S200) of forming an insulating layer (110) on the surfaces of the upper conductive layer (100) and the lower conductive layer (200) which are exposed to the outside; a third step (S300) of forming a plurality of LED mounting surfaces (120) by proc