Apparatus for adhering adhesive tape, and pressure bonding apparatus

An ACF adhering apparatus takes a tape (20), wherein an ACF tape is laminated on a separator tape (20a), from a supply reel (22) having the tape (20) taken up thereon, and adheres the ACF tape onto the electrode of a substrate by pressing the tape (20) using a pressure bonding tool (18) so as to efficiently adhere the ACF and other adhesive tapes onto a plurality of required areas arranged in parallel on the substrate or to efficiently bond with pressure a material to be bonded. The ACF adhering apparatus is provided with a tape traveling route setting means (28), which arranges the diameter direction of the supply reel (22) to substantially orthogonally intersect the longitudinal direction of the pressure bonding tool (18), and makes the tape (20) taken from the supply reel (22) travel between the pressure bonding tool (18) and the substrate in the longitudinal direction of the pressure bonding tool (18) by means of a tape travel direction converting section (27a) provided at least on one area. Thus, the wid