Apparatus and methods for digital manufacturing

A method for manufacturing objects/materials includes selectively arranging the predetermined components in a staging area, substantially simultaneously selectively removing two or more of the selectively arranged predetermined components according to a predetermined removal plan and substantially s...

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Bibliographische Detailangaben
Hauptverfasser:	LIPSON HOD, HILLER JONATHAN D
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for manufacturing objects/materials includes selectively arranging the predetermined components in a staging area, substantially simultaneously selectively removing two or more of the selectively arranged predetermined components according to a predetermined removal plan and substantially simultaneously placing the selectively removed components, the removed components being substantially simultaneously placed at a predetermined location. A system for practicing the method includes a supply of the predetermined components, an arranging subsystem receiving the predetermined components and arranging the predetermined components according to a predetermined arrangement, a selective removal subsystem for selectively removing at least two of the selectively arranged predetermined components, the selectively removing occurring substantially simultaneously and according to a predetermined removal prescription, and a placement subsystem for substantially simultaneously placing the selectively removed compone