Substrate mounting table and method for manufacturing the same, and substrate processing apparatus

The invention provides a mounting table which may not damage substrates and can effectively prevent etching pits. The mounting table (5A) comprises a basic material (7) formed by conductive materials such as aluminium or stainless steel (SUS) and an insulation film (8) arranged on the basic material...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MINAMI MASATO, OKUYAMA KOICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention provides a mounting table which may not damage substrates and can effectively prevent etching pits. The mounting table (5A) comprises a basic material (7) formed by conductive materials such as aluminium or stainless steel (SUS) and an insulation film (8) arranged on the basic material (7). The upper surface of the insulation film (8) is a substrate mounting surface(50) for mountingFPD glass substrateS (S). The substrate mounting surface(50) comprises a rough part (51) with a rough surface of which the surface roughness Ra ranging from 2 micrometers to 6 micrometers and a smooth part (53) encircling the rough part (51) and having a surface roughness Ra less than 2 micrometers.