Preparation method of restructured surface of low-defect large-area silicon (100)-2xl
The invention provides a preparation method of the restructured surface of a low-defect large-area silicon (100)-2xl. The preparation method is characterized by comprising the following steps of: firstly, breaking down a silicon (100) sample by a direct-current power supply; secondly, cleaning the s...
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention provides a preparation method of the restructured surface of a low-defect large-area silicon (100)-2xl. The preparation method is characterized by comprising the following steps of: firstly, breaking down a silicon (100) sample by a direct-current power supply; secondly, cleaning the surface of the silicon; thirdly, growing a silver layer with the thickness of 0.5 nanometer on the surface of the cleaned silicon by a molecular beam deposition technology; fourthly, evenly distributing a plurality of silver atoms on the surface of the Si sample; and fifthly, quickly warming the sample to 1200 DEG C, so that all the silver atoms are removed and absorbed, and the restructured surface of the low-defect large-area silicon (100)-2xl can be prepared. The preparation method has the technical effects that: 1, when the restructured surface of the silicon (100)-2xl is prepared, the problem of the sample fracture caused by the overquick heating is avoided by adopting a step type cleaning method in a heating w |
---|