Laminate and method for producing laminate

The present invention provides a laminate wherein surface roughness of a cured material layer subjected to roughening can be decreased and bonding strength between the cured material layer and a metal layer can be increased. Specifically disclosed is a laminate (11) comprising a cured material layer...

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Bibliographische Detailangaben
Hauptverfasser:	GOTO NOBUHIRO, YOKOTA REONA, HEISHI MASARU, KOUYANAGI HIROSHI, TANAKA TOSHIAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a laminate wherein surface roughness of a cured material layer subjected to roughening can be decreased and bonding strength between the cured material layer and a metal layer can be increased. Specifically disclosed is a laminate (11) comprising a cured material layer (3A) which is formed as follows: after laminating a resin film on a substrate (12), the resin film is preliminarily cured at 100-200 DEG C, thereby forming a preliminarily cured material layer; and then the surface of the cured material layer is subjected to roughening at 55-80 DEG C. The resin film is composed of a resin composition containing an epoxy resin, a phenol curing agent, a curing accelerator, and a surface-treated substance obtained by surface-treating 100 parts by weight of an inorganic filler having an average particle diameter of 0.05-1.5 [mu]m with 0.5-3.5 parts by weight of a silane coupling agent. The silane coupling agent has an epoxy group, an imidazole group or an amino group.