LED bonding wire heating mold

The invention provides a light emitting diode (LED) bonding wire heating mold, which comprises a base bracket (1), a heating device (2) and a thermal insulation device (4), wherein the heating device (2) is arranged inside the base bracket (1) and protrudes upwards; the thermal insulation device (4) extends from the upper surface of the base bracket (1) upwards and an installation space is formed between the thermal insulation device (4) and the heating device; and a lamp needed to be heated is arranged in the installation space and is tightly contacted with the heating device and the thermal insulation device respectively so as to realize the heating function. When a bracket-free integrated package technology is adopted, namely a chip is directly packaged on the lamp base, the heating mold can easily weld a wire on the lamp.