BGA footprint pattern for increasing number of routing channels per PCB layer

The present invention discloses a BGA footprint pattern for increasing number of routing channels per PCB layer. The printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, wherein the ci...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YUE PING, CLEVELAND JOHN, SIDDHAYE SHREERAM, SRINIVAS CHEBROLU, VENKATARAMAN SRINIVAS, REYNOV BORIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention discloses a BGA footprint pattern for increasing number of routing channels per PCB layer. The printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, wherein the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, wherein the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and wherein a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.