Method for manufacturing encapsulation of light emitting diode

The invention discloses a method for manufacturing encapsulation of a light emitting diode. The method comprises the following steps: first, configuring at least one light emitting diode chip on a first surface of a lead frame, wherein the light emitting diode chip is connected with the lead frame,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAI JIELONG, LIN XIUREN, LIN JIANXIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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