Method for manufacturing encapsulation of light emitting diode

The invention discloses a method for manufacturing encapsulation of a light emitting diode. The method comprises the following steps: first, configuring at least one light emitting diode chip on a first surface of a lead frame, wherein the light emitting diode chip is connected with the lead frame, and at least one radiating area is formed on a second surface of the lead frame and corresponds to the light emitting diode chip; configuring a lead conducting material in the radiating area, wherein the heat conducting material is directly contacted with the lead frame; and consolidating to ensure that the heat conducting is consolidated into a plurality of radiating blocks, wherein the radiating blocks are directly contacted with the lead frame, and the process temperature of the consolidation process is actually lower than 300 DEG C.