Production device, production method, test apparatus and integrated circuit package
The invention relates to a production device, a production method, a test apparatus and an integrated circuit package. Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening se...
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| creator | TANAKA SADAKI KOGURE YOSHINARI TAKASU SEIICHI |
| description | The invention relates to a production device, a production method, a test apparatus and an integrated circuit package. Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package. |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN102082073A |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Production device, production method, test apparatus and integrated circuit package |
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