Electronic device component, electronic device and related method

The invention relates to an electronic device component, an electronic device and a related method. The electronic device can comprise one or many components structured via connecting several elements. In order to provide components provided with a reduced or smaller size or a connection of cross sections and constructed to be provided with large common difference, a material can be provided, the material flow among elements in a first state before being changed to a second state, and adheres to each element in the second state and provides reliable connection in structure. Composite material can be soldered among elements. Under some circumstances, the inner surfaces of these elements can comprise one or more characteristic members used for enhancing combination of elements and provide materials of interfaces among elements.