Semiconductor device package for shielding electromagnetic interference

Described are a semiconductor device package for shielding electromagnetic interference and a related method. In one embodiment, the semiconductor device package includes a grounding element which is disposed adjacent to the periphery of a substrate unit and at least partially extends between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an electromagnetic interference shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.